Наименование | Производитель | Корпус | Норма упаковки | Capacity (GB) | Size | NAND Flash | Protocol/Interface | Operating oltage (V) | Interface | Запрос |
---|---|---|---|---|---|---|---|---|---|---|
FEMDME004G-A8A39 | Longsys | FBGA153 | 4 | 11.5*13*1.0 mm | pSLC | eMMC 5.1 | 1.8/3.3 | HS400 | ||
Automotive eMMC Grade2
Capacity (GB): 4
Size: 11.5*13*1.0 mm
NAND Flash: pSLC
Protocol/Interface: eMMC 5.1
Operating oltage (V): 1.8/3.3
Interface: HS400
Operating Temperature Range (℃): -40~105
|
||||||||||
FEMDME008G-A8A39 | Longsys | FBGA153 | 8 | 11.5*13*1.0 mm | MLC | eMMC 5.1 | 1.8/3.3 | HS400 | ||
Automotive eMMC Grade2
Capacity (GB): 8
Size: 11.5*13*1.0 mm
NAND Flash: MLC
Protocol/Interface: eMMC 5.1
Operating oltage (V): 1.8/3.3
Interface: HS400
Operating Temperature Range (℃): -40~105
|
||||||||||
FEMDME008G-A8A43 | Longsys | FBGA153 | 8 | 11.5*13*1.0 mm | pSLC | eMMC 5.1 | 1.8/3.3 | HS400 | ||
Automotive eMMC Grade2
Capacity (GB): 8
Size: 11.5*13*1.0 mm
NAND Flash: pSLC
Protocol/Interface: eMMC 5.1
Operating oltage (V): 1.8/3.3
Interface: HS400
Operating Temperature Range (℃): -40~105
|
||||||||||
FEMDME016G-A8A43 | Longsys | FBGA153 | 16 | 11.5*13*1.0 mm | MLC | eMMC 5.1 | 1.8/3.3 | HS400 | ||
Automotive eMMC Grade2
Capacity (GB): 16
Size: 11.5*13*1.0 mm
NAND Flash: MLC
Protocol/Interface: eMMC 5.1
Operating oltage (V): 1.8/3.3
Interface: HS400
Operating Temperature Range (℃): -40~105
|
||||||||||
FEMDME032G-A8A58 | Longsys | FBGA153 | 32 | 11.5*13*1.0 mm | MLC | eMMC 5.1 | 1.8/3.3 | HS400 | ||
Automotive eMMC Grade2
Capacity (GB): 32
Size: 11.5*13*1.0 mm
NAND Flash: MLC
Protocol/Interface: eMMC 5.1
Operating oltage (V): 1.8/3.3
Interface: HS400
Operating Temperature Range (℃): -40~105
|
||||||||||
FEMDME064G-A8A58 | Longsys | FBGA153 | 64 | 11.5*13*1.2 mm | MLC | eMMC 5.1 | 1.8/3.3 | HS400 | ||
Automotive eMMC Grade2
Capacity (GB): 64
Size: 11.5*13*1.2 mm
NAND Flash: MLC
Protocol/Interface: eMMC 5.1
Operating oltage (V): 1.8/3.3
Interface: HS400
Operating Temperature Range (℃): -40~105
|
||||||||||
FEMDMW008G-88A39 | Longsys | FBGA153 | 8 | 11.5*13*1.0 mm | MLC | eMMC 5.1 | 1.8/3.3 | HS400 | ||
Automotive eMMC Grade3
Capacity (GB): 8
Size: 11.5*13*1.0 mm
NAND Flash: MLC
Protocol/Interface: eMMC 5.1
Operating oltage (V): 1.8/3.3
Interface: HS400
Operating Temperature Range (℃): -40~105
|
||||||||||
FEMDMW016G-88A43 | Longsys | FBGA153 | 16 | 11.5*13*1.0 mm | MLC | eMMC 5.1 | 1.8/3.3 | HS400 | ||
Automotive eMMC Grade3
Capacity (GB): 16
Size: 11.5*13*1.0 mm
NAND Flash: MLC
Protocol/Interface: eMMC 5.1
Operating oltage (V): 1.8/3.3
Interface: HS400
Operating Temperature Range (℃): -40~105
|
||||||||||
FEMDMW032G-88A19 | Longsys | FBGA153 | 32 | 11.5*13*1.0 mm | 3D NAND | eMMC 5.1 | 1.8/3.3 | HS400 | ||
Automotive eMMC Grade3
Capacity (GB): 32
Size: 11.5*13*1.0 mm
NAND Flash: 3D NAND
Protocol/Interface: eMMC 5.1
Operating oltage (V): 1.8/3.3
Interface: HS400
Operating Temperature Range (℃): -40~105
|
||||||||||
FEMDMW064G-88A19 | Longsys | FBGA153 | 64 | 11.5*13*1.0 mm | 3D NAND | eMMC 5.1 | 1.8/3.3 | HS400 | ||
Automotive eMMC Grade3
Capacity (GB): 64
Size: 11.5*13*1.0 mm
NAND Flash: 3D NAND
Protocol/Interface: eMMC 5.1
Operating oltage (V): 1.8/3.3
Interface: HS400
Operating Temperature Range (℃): -40~105
|
||||||||||
FEMDMW128G-88A19 | Longsys | FBGA153 | 128 | 11.5*13*1.2 mm | 3D NAND | eMMC 5.1 | 1.8/3.3 | HS400 | ||
Automotive eMMC Grade3
Capacity (GB): 128
Size: 11.5*13*1.2 mm
NAND Flash: 3D NAND
Protocol/Interface: eMMC 5.1
Operating oltage (V): 1.8/3.3
Interface: HS400
Operating Temperature Range (℃): -40~105
|
||||||||||
FEMDRM008G-58A39 | Longsys | FBGA153 | 8 | 11.5*13*1.0 mm | MLC | eMMC 5.1 | 1.8/3.3 | HS400 | ||
Industrial eMMC
Capacity (GB): 8
Size: 11.5*13*1.0 mm
NAND Flash: MLC
Protocol/Interface: eMMC 5.1
Operating oltage (V): 1.8/3.3
Interface: HS400
Operating Temperature Range (℃): -25~85
|
||||||||||
FEMDRM016G-58A43 | Longsys | FBGA153 | 16 | 11.5*13*1.0 mm | MLC | eMMC 5.1 | 1.8/3.3 | HS400 | ||
Industrial eMMC
Capacity (GB): 16
Size: 11.5*13*1.0 mm
NAND Flash: MLC
Protocol/Interface: eMMC 5.1
Operating oltage (V): 1.8/3.3
Interface: HS400
Operating Temperature Range (℃): -25~85
|
||||||||||
FEMDRM032G-A3A55 | Longsys | FBGA153 | 32 | 11.5*13*1.0 mm | 3D NAND | eMMC 5.1 | 1.8/3.3 | HS400 | ||
Industrial eMMC
Capacity (GB): 32
Size: 11.5*13*1.0 mm
NAND Flash: 3D NAND
Protocol/Interface: eMMC 5.1
Operating oltage (V): 1.8/3.3
Interface: HS400
Operating Temperature Range (℃): -25~85
|
||||||||||
FEMDRM064G-A3A56 | Longsys | FBGA153 | 64 | 11.5*13*1.0 mm | 3D NAND | eMMC 5.1 | 1.8/3.3 | HS400 | ||
Industrial eMMC
Capacity (GB): 64
Size: 11.5*13*1.0 mm
NAND Flash: 3D NAND
Protocol/Interface: eMMC 5.1
Operating oltage (V): 1.8/3.3
Interface: HS400
Operating Temperature Range (℃): -25~85
|
||||||||||
FEMDRM128G-A3A56 | Longsys | FBGA153 | 128 | 11.5*13*1.0 mm | 3D NAND | eMMC 5.1 | 1.8/3.3 | HS400 | ||
Industrial eMMC
Capacity (GB): 128
Size: 11.5*13*1.0 mm
NAND Flash: 3D NAND
Protocol/Interface: eMMC 5.1
Operating oltage (V): 1.8/3.3
Interface: HS400
Operating Temperature Range (℃): -25~85
|
||||||||||
FEMDRW008G-88A39 | Longsys | FBGA153 | 8 | 11.5*13*1.0 mm | MLC | eMMC 5.1 | 1.8/3.3 | HS400 | ||
Industrial Wide-Temperature eMMC
Capacity (GB): 8
Size: 11.5*13*1.0 mm
NAND Flash: MLC
Protocol/Interface: eMMC 5.1
Operating oltage (V): 1.8/3.3
Interface: HS400
Operating Temperature Range (℃): -40~85
|
||||||||||
FEMDRW016G-88A43 | Longsys | FBGA153 | 16 | 11.5*13*1.0 mm | MLC | eMMC 5.1 | 1.8/3.3 | HS400 | ||
Industrial Wide-Temperature eMMC
Capacity (GB): 16
Size: 11.5*13*1.0 mm
NAND Flash: MLC
Protocol/Interface: eMMC 5.1
Operating oltage (V): 1.8/3.3
Interface: HS400
Operating Temperature Range (℃): -40~85
|
||||||||||
FEMDRW032G-88A19 | Longsys | FBGA153 | 32 | 11.5*13*1.0 mm | 3D NAND | eMMC 5.1 | 1.8/3.3 | HS400 | ||
Industrial Wide-Temperature eMMC
Capacity (GB): 32
Size: 11.5*13*1.0 mm
NAND Flash: 3D NAND
Protocol/Interface: eMMC 5.1
Operating oltage (V): 1.8/3.3
Interface: HS400
Operating Temperature Range (℃): -40~85
|
||||||||||
FEMDRW064G-88A19 | Longsys | FBGA153 | 64 | 11.5*13*1.0 mm | 3D NAND | eMMC 5.1 | 1.8/3.3 | HS400 | ||
Industrial Wide-Temperature eMMC
Capacity (GB): 64
Size: 11.5*13*1.0 mm
NAND Flash: 3D NAND
Protocol/Interface: eMMC 5.1
Operating oltage (V): 1.8/3.3
Interface: HS400
Operating Temperature Range (℃): -40~85
|
||||||||||
FEMDRW128G-88A19 | Longsys | FBGA153 | 128 | 11.5*13*1.2 mm | 3D NAND | eMMC 5.1 | 1.8/3.3 | HS400 | ||
Industrial Wide-Temperature eMMC
Capacity (GB): 128
Size: 11.5*13*1.2 mm
NAND Flash: 3D NAND
Protocol/Interface: eMMC 5.1
Operating oltage (V): 1.8/3.3
Interface: HS400
Operating Temperature Range (℃): -40~85
|
||||||||||
FEUDME064G-B8A19 | Longsys | FBGA153 | 64 | 11.5 x 13 x 1.2mm | 3D NAND | UFS 2.1 Gear3 2L | 1.8/3.3 | HS400 | ||
Automotive UFS
Capacity (GB): 64
Size: 11.5 x 13 x 1.2mm
NAND Flash: 3D NAND
Protocol/Interface: UFS 2.1 Gear3 2L
Operating oltage (V): 1.8/3.3
Interface: HS400
Operating Temperature Range (℃): -40~105
|
||||||||||
FEUDME128G-B8A19 | Longsys | FBGA153 | 128 | 11.5 x 13 x 1.2mm | 3D NAND | UFS 2.1 Gear3 2L | 1.8/3.3 | HS400 | ||
Automotive UFS
Capacity (GB): 128
Size: 11.5 x 13 x 1.2mm
NAND Flash: 3D NAND
Protocol/Interface: UFS 2.1 Gear3 2L
Operating oltage (V): 1.8/3.3
Interface: HS400
Operating Temperature Range (℃): -40~105
|
||||||||||
FEUDME128G-C8H09 | Longsys | FBGA153 | 128 | 11.5 x 13 x 1.2mm | 3D NAND | UFS 3.1 Gear4 2L | 1.2/2.5 | HS400 | ||
Automotive UFS
Capacity (GB): 128
Size: 11.5 x 13 x 1.2mm
NAND Flash: 3D NAND
Protocol/Interface: UFS 3.1 Gear4 2L
Operating oltage (V): 1.2/2.5
Interface: HS400
Operating Temperature Range (℃): -40~105
|
||||||||||
FEUDME256G-C8H09 | Longsys | FBGA153 | 256 | 11.5 x 13 x 1.2mm | 3D NAND | UFS 3.1 Gear4 2L | 1.2/2.5 | HS400 | ||
Automotive UFS
Capacity (GB): 256
Size: 11.5 x 13 x 1.2mm
NAND Flash: 3D NAND
Protocol/Interface: UFS 3.1 Gear4 2L
Operating oltage (V): 1.2/2.5
Interface: HS400
Operating Temperature Range (℃): -40~105
|
||||||||||
FSEIASLD-128G | Longsys | FBGA153 | 128 | 11.5*13*1.2 mm | 3D NAND | eMMC 5.1 | 1.8/3.3 | HS400 | ||
Industrial eMMC
Capacity (GB): 128
Size: 11.5*13*1.2 mm
NAND Flash: 3D NAND
Protocol/Interface: eMMC 5.1
Operating oltage (V): 1.8/3.3
Interface: HS400
Operating Temperature Range (℃): -25~85
|
||||||||||
FSEIASLD-32G | Longsys | FBGA153 | 32 | 11.5*13*1.0 mm | 3D NAND | eMMC 5.1 | 1.8/3.3 | HS400 | ||
Industrial eMMC
Capacity (GB): 32
Size: 11.5*13*1.0 mm
NAND Flash: 3D NAND
Protocol/Interface: eMMC 5.1
Operating oltage (V): 1.8/3.3
Interface: HS400
Operating Temperature Range (℃): -25~85
|
||||||||||
FSEIASLD-64G | Longsys | FBGA153 | 64 | 11.5*13*1.0 mm | 3D NAND | eMMC 5.1 | 1.8/3.3 | HS400 | ||
Industrial eMMC
Capacity (GB): 64
Size: 11.5*13*1.0 mm
NAND Flash: 3D NAND
Protocol/Interface: eMMC 5.1
Operating oltage (V): 1.8/3.3
Interface: HS400
Operating Temperature Range (℃): -25~85
|
||||||||||
Subsize eMMC 128GB | Longsys | 153Ball | 128 | 7.2*7.2*0.8mm | TLC | eMMC 5.1 | 1.8/3.3 | HS400 | ||
Subsize eMMC
Capacity (GB): 128
Size: 7.2*7.2*0.8mm
NAND Flash: TLC
Protocol/Interface: eMMC 5.1
Operating oltage (V): 1.8/3.3
Interface: HS400
Operating Temperature Range (℃): -25~85
|
||||||||||
Subsize eMMC 32GB | Longsys | 153Ball | 32 | 9*10*0.8mm | TLC | eMMC 5.1 | 1.8/3.3 | HS400 | ||
Subsize eMMC
Capacity (GB): 32
Size: 9*10*0.8mm
NAND Flash: TLC
Protocol/Interface: eMMC 5.1
Operating oltage (V): 1.8/3.3
Interface: HS400
Operating Temperature Range (℃): -25~85
|
||||||||||
Subsize eMMC 4GB | Longsys | 153Ball | 4 | 9*7.5*0.8mm | MLC | eMMC 5.1 | 1.8/3.3 | HS400 | ||
Subsize eMMC
Capacity (GB): 4
Size: 9*7.5*0.8mm
NAND Flash: MLC
Protocol/Interface: eMMC 5.1
Operating oltage (V): 1.8/3.3
Interface: HS400
Operating Temperature Range (℃): -25~85
|
||||||||||
Subsize eMMC 64GB | Longsys | 153Ball | 64 | 7.2*7.2*0.8mm | TLC | eMMC 5.1 | 1.8/3.3 | HS400 | ||
Subsize eMMC
Capacity (GB): 64
Size: 7.2*7.2*0.8mm
NAND Flash: TLC
Protocol/Interface: eMMC 5.1
Operating oltage (V): 1.8/3.3
Interface: HS400
Operating Temperature Range (℃): -25~85
|
||||||||||
Subsize eMMC 8GB | Longsys | 153Ball | 8 | 9*7.5*0.8mm | MLC | eMMC 5.1 | 1.8/3.3 | HS400 | ||
Subsize eMMC
Capacity (GB): 8
Size: 9*7.5*0.8mm
NAND Flash: MLC
Protocol/Interface: eMMC 5.1
Operating oltage (V): 1.8/3.3
Interface: HS400
Operating Temperature Range (℃): -25~85
|